Product details
Product Detail
Product Description
The polycrystalline diamond layer and carbide alloy substrate bonding interface of U-type PDC employs a combined non-planar bonding structure. The features of U-type PDC:
I. The external ring adopts an oblique cone structure instead of a step structure. This structure ensures the normal contraction of diamond powder during ultra-high pressure sintering and minimizes the residual stress caused by interface structure.
II. The circular area in the center of interface comprises a row of corrugated grooves and single trapezoidal grooves that are perpendicular thereto. The single trapezoidal groove is wider and deeper than corrugated teeth in rows, and this enhances the engagement force of PCD layer with carbide alloy substrate.
Since the interface of U-type PDC is directional, directional marks are set at the side of carbide alloy substrate.
I. The external ring adopts an oblique cone structure instead of a step structure. This structure ensures the normal contraction of diamond powder during ultra-high pressure sintering and minimizes the residual stress caused by interface structure.
II. The circular area in the center of interface comprises a row of corrugated grooves and single trapezoidal grooves that are perpendicular thereto. The single trapezoidal groove is wider and deeper than corrugated teeth in rows, and this enhances the engagement force of PCD layer with carbide alloy substrate.
Since the interface of U-type PDC is directional, directional marks are set at the side of carbide alloy substrate.
